Power chips are attached to outside circuits through packaging, and their performance depends on the assistance of the product packaging. In high-power situations, power chips are usually packaged as power components. Chip interconnection describes the electrical link on the top surface area of the chip, which is generally light weight aluminum bonding cable in traditional modules. ^ Standard power module package cross-section

Today, business silicon carbide power modules still mainly utilize the packaging technology of this wire-bonded traditional silicon IGBT module. They deal with troubles such as huge high-frequency parasitic specifications, inadequate heat dissipation ability, low-temperature resistance, and inadequate insulation toughness, which limit using silicon carbide semiconductors. The display screen of exceptional efficiency. In order to resolve these troubles and completely manipulate the substantial possible benefits of silicon carbide chips, several new product packaging innovations and services for silicon carbide power components have actually emerged in the last few years.

Silicon carbide power component bonding technique

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have actually created from gold cable bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually established from gold cords to copper wires, and the driving force is cost decrease; high-power gadgets have actually established from aluminum cords (strips) to Cu Clips, and the driving pressure is to improve item performance. The better the power, the greater the demands.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared to standard bonding product packaging approaches, Cu Clip innovation has the following benefits:

1. The link between the chip and the pins is made of copper sheets, which, to a specific extent, replaces the typical cable bonding approach between the chip and the pins. For that reason, a distinct package resistance value, higher current flow, and far better thermal conductivity can be gotten.

2. The lead pin welding location does not require to be silver-plated, which can totally save the price of silver plating and poor silver plating.

3. The item look is entirely constant with regular products and is mainly made use of in servers, mobile computers, batteries/drives, graphics cards, electric motors, power materials, and various other areas.

Cu Clip has two bonding methods.

All copper sheet bonding technique

Both the Gate pad and the Source pad are clip-based. This bonding technique is a lot more expensive and complex, yet it can accomplish much better Rdson and better thermal impacts.

( copper strip)

Copper sheet plus cord bonding technique

The source pad makes use of a Clip method, and the Gate makes use of a Cable technique. This bonding approach is somewhat cheaper than the all-copper bonding method, conserving wafer location (appropriate to really small gateway areas). The process is easier than the all-copper bonding approach and can get far better Rdson and better thermal result.

Provider of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper, please feel free to contact us and send an inquiry.

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